氢氧化铝对有机硅电子灌封胶性能的影响  

Influences of Al(OH)_3 on properties of organosilicon electronic-pouring sealant

作　　者：胡新嵩 陈精华 黄德裕 

机构地区：[1]广州市高士实业有限公司,广东广州510450

出　　处：《中国胶粘剂》2013年第4期33-36,共4页China Adhesives

基　　金：2012年科技型中小企业技术创新基金重点项目(12C26214405409);2012年广州市科技型中小企业创新基金专项所属重点项目(2012J4200098)

摘　　要：以端乙烯基硅油为基胶、含氢硅油为交联剂、γ-甲基丙烯酰氧基丙基三甲氧基硅烷(KH-570)为表面处理剂、Al(OH)3或Al(OH)3/铂络合物为阻燃剂,制备阻燃型有机硅电子灌封胶。研究结果表明:对Al(OH)3表面进行处理、降低其粒径、增加其含量、Al(OH)3/铂络合物并用等均有利于提升灌封胶的阻燃性能;当w(KH-570)=0.5%[相对于Al(OH)3质量而言]、Al(OH)3的平均粒径为2.6μm、m(5.0μmAl2O3):m[2.6μm Al(OH)3]=160:40和w(铂络合物)=0.002%(相对于基胶质量而言)时,可制得阻燃性优异的有机硅电子灌封胶。With a vinyl-terminal silicon oil as matrix ,a silicon oil containing hydrogen as cross hnker, a r-methacryloxypropyltrimethoxysilane （KH-570） as surface treatment agent, A1 （ OH ） 3 or A1 （OH） 3/platinum complex compound as flame retardants,an organosilicon electronic-pouring sealant with flame-retardant was prepared. The research results showed that the flame-retardant of pouring sealant could all be enhanced by following methods such as surface treatment of Al（OH）3,reducing its particle sizes and increasing its contents, using Al（OH）3/platinum complex compound,and other methods. The organosilieon electronic-pouring sealant had excellent flame-retardant when mass fraction of KH-570 was 0.5% in Al（OH）3,the average particle size of AI（OH）3 was 2.6 Ixm,mass ratio of m（5.0 μm A1203）：m[2.6 μm AI（OH）3] was 160：40,and mass fraction of platinum complex compound was 0.002% in matrix.

关 键 词：氢氧化铝 阻燃剂 有机硅 灌封胶 

分 类 号：TQ436.6[化学工程] TQ437.6