CSP轧后层流冷却温度场模拟  

Simulation of Temperature Field in Laminar Flow Cooling after CSP Rolling

作　　者：尹皓[1] 程晓茹[1] 刘炼[1] 陈凯[1] 黄福洲[1] 邹辉[1] 

机构地区：[1]武汉科技大学材料与冶金学院,湖北武汉430081

出　　处：《热加工工艺》2013年第9期94-96,共3页Hot Working Technology

摘　　要：利用有限元软件,对CSP轧后层流冷却过程进行了温度场模拟。对比了层流冷却的3种不同冷却方式,即前段连续冷却、前段间断冷却和后段连续冷却。分析了带钢的温度场,确定了快速冷却开始温度,分析了冷却速度对最终晶粒尺寸的影响。该研究为进一步研究带钢轧后冷却过程中组织性能的变化提供了依据。The temperature field in laminar flow cooling after CSP rolling was simulated by using finite element software. Three kinds of cooling methods were contrasted, that is forepart continuous cooling, forepart discontinuous cooling and end part continuous cooling, The temperature field of strip steel was analyzed, and the beginning lemperature of rapid cooling was determined. The relationship between cooling velocity and ultimate crystal grain size was analyzed. The study provides guidance for further studying microstructure and properties of strip steel in cooling process.

关 键 词：有限元 CSP 层流冷却 温度场模拟 

分 类 号：TG335.11[金属学及工艺—金属压力加工]