基于专利分析的我国LED封装技术存在问题研究  

Research on the Exist Problems about Chinese LED Packaging Technology Based on Patent Analysis

作　　者：罗恺[1] 袁晓东[1] 

机构地区：[1]华中科技大学管理学院,武汉430074

出　　处：《情报杂志》2013年第5期94-98,共5页Journal of Intelligence

基　　金：教育部人文社会科学规划基金资助项目"LED产业专利分散度测量及专利战略选择研究"(编号:11YJA630188);华中科技大学自主创新研究基金项目"专利商业模式创新对高校专利管理影响及对策研究"(编号:2012TS066)

摘　　要：随着我国LED封装产业的不断发展,专利申请呈现大幅度增长趋势,出现了大量的专利权人。对我国LED封装技术专利态势进行分析,发现国外企业专利量有一定的优势。利用等级系数法和分散度指数测量我国LED封装技术专利分布情况,结果显示,我国LED封装技术专利权人众多,专利量却处于下游。为了应对我国LED封装技术专利出现的问题,提出了相应的应对建议。With the developing of Chinese LED packaging industry ,patent applications present substantial growth trend in order to emerge many patentee. This paper find the foreign company patens have advantage based on Chinese LED packaging technology patents analysis. Using the grading coefficient and fragmented index measured the distribution of the Chinese LED packaging technology patents, the result showed there are many Chinese LED packaging technology patentee,but,the number of patents are in downstream. For solving the prob- lems about Chinese LED packing technology patents, this paper put forward related suggestions.

关 键 词：LED封装产业 LED封装技术专利 专利分析 专利获取战略 

分 类 号：G306[文化科学]