电磁屏蔽剂银/镍/玻璃微珠粉体的制备与性能  

Preparation and properties of silver/nickel/glass microsphere powders used for electromagnetic shielding

作　　者：刘玉凤[1] 于名讯[1] 徐勤涛[1] 潘士兵[1] 黄成亮[1] 于万增[1] 

机构地区：[1]中国兵器工业集团第五三研究所,山东济南250031

出　　处：《电镀与涂饰》2013年第5期15-19,共5页Electroplating & Finishing

摘　　要：采用化学镀法在玻璃微珠表面先沉积镍镀层、再化学镀银,制备了Ag/Ni/玻璃微珠复合粉体。讨论了活化剂氯化钯和主盐硫酸镍的浓度、镀液pH对玻璃微珠表面化学镀镍层表面形貌的影响,得出了较佳的镀镍工艺条件:PdCl20.3g/L,NiSO4·6H2O30g/L,pH11。在此基础上化学镀银,采用扫描电镜和能谱分析对Ag/Ni/玻璃微珠结构进行了表征,测试了粉体的体积电阻率、介电常数、磁导率和磁性能。结果表明,镀镍玻璃微珠表面成功包覆一层银,Ag/Ni/玻璃微珠复合粉体的体积电阻率由Ni/玻璃微珠的2.28×104·cm降低至7.64×105·cm,导电性、介电损耗和磁损耗均提高;Ag/Ni/玻璃微珠粉体的饱和磁化强度为27.2emu/g,可以作为一种宽频电磁屏蔽材料的填料。The Ag/Ni/glass microsphere composite powders were prepared by electroless nickel plating on the surface of glass microsphere followed by electroless silver plating. The effects of the concentrations of PdC12 as activator and nickel sulfate as main salt, and bath pH on surface morphology of electroless nickel layer on glass microsphere surface were discussed. The optimal conditions for electroless nickel plating were obtained as follows： PdC12 0.3 g/L, NiSO4·6H20 30 g/L, and pH 11. Electroless silver plating was carried out with the electroless nickel plated glass microsphere. The structure of Ag/Ni/glass microsphere was characterized by scanning electron microscopy and energy-dispersive spectroscopic analysis, and the volume resistivity, dielectric constant, magnetic permeability, and magnetic property of the powders were tested. The results indicated that a silver layer was successfully coated on the surface of nickel-plated glass microsphere, and the volume resistivity of the Ag/Ni/glass microsphere composite powders is decreased from 2.28 ×10^-4 Ω·cm of Ni/glass microsphere to 7.64 ×10^-5 Ω·cm, and the conductivity, dielectric loss and magnetic loss are increased. The saturated magnetic strength of Ag/Ni/glass microsphere is 27.2 emu/g. The Ag/Ni/glass microsphere can be used as a filler of broadband electromagnetic shielding material.

关 键 词：玻璃微珠 化学镀 镍 银 电磁屏蔽 体积电阻率 磁性 

分 类 号：TQ153.12[化学工程—电化学工业] TQ153.16