铝基刚挠结合板制作工艺探讨  

The technology in manufacturing of aluminum substrate rigid-flex board

作　　者：石学兵 唐宏华 陈裕韬 陈春 

机构地区：[1]深圳市金百泽电子科技股份有限公司,广东深圳518049 [2]惠州市金百泽电路科技有限公司,广东惠州516083

出　　处：《印制电路信息》2013年第5期87-90,共4页Printed Circuit Information

摘　　要：金属铝基由于其良好的散热性能,广泛应用于LED方面;但随着PCB技术进一步向短、小、轻、薄的方向发展,其平面安装技术在安装空间方面受到了极大的限制,因此,如何实现金属基板三维折叠安装成为业界新的研究课题。对铝基+软硬结合板的制作工艺进行了可行性探讨,通过铝基表面复合处理工艺+纯胶预贴局部撕胶+二氧化碳激光切割技术有效实现了金属铝基与挠性电路的有机结合,满足了客户对金属基板实现三维安装的特种需求。Aluminum board is widely applied in energy-saving LED, due to its good thermal conductivity. But, with the rapid development of the requirements for more and more slighter, more and more smaller, more and more thinner PCB, the installation space of surface mounting technology is extremely limited. So there is a new subject of how to realize the folded three-dimension mounting of metal-based board. This paper discusses the feasibility of the process of the Aluminum substrate Rigid-Flex board. It successfully combines aluminum substrate with the,flexible circuit by using a composite treatment technology of aluminum board surface, the partly peeling after adhesive pre-pasted and CO2 laser cutting technology. And it can meet customer＇s special requirements for three-dimension mounting of metal-based board.

关 键 词：铝基表面复合处理工艺 纯胶预贴 局部撕胶 二氧化碳激光切割技术 

分 类 号：TN41[电子电信—微电子学与固体电子学]