氧化还原法刻蚀制备铜基超疏水表面  

Fabrication of Copper-based Superhydrophobic Surface by Redox Etching

作　　者：马福民[1,2] 郝全勇 张燕 阮敏[1,2] 于占龙[1,2] 

机构地区：[1]湖北理工学院矿区环境污染控制与修复湖北省重点实验室,黄石435003 [2]化学与材料工程学院,黄石435003

出　　处：《科学技术与工程》2013年第14期3960-3962,3967,共4页Science Technology and Engineering

基　　金：国家自然科学基金(51272082、51202082);湖北省科技厅项目(2010CDA026);湖北理工学院项目(11yjz04R)资助

摘　　要：通过三氯化铁和铜的氧化还原反应,在铜基材料上制备了具有一定粗糙度的微结构表面。该表面使用月桂酸进行表面处理后,表现出优异的超疏水性能。水在该表面上的接触角可达161.6°。表面微结构和超疏水性能受刻蚀时间的影响较大。随着刻蚀时间的增加,表面上的微粗糙结构开始逐渐形成并增大,此过程对应的水的接触角不断增加,到一定程度后,逐渐趋于稳定。进一步考察了刻蚀剂的浓度、修饰剂的种类、浓度和时间等条件对于该表面超疏水性能的影响。结果表明,反应和修饰条件对铜表面的表面润湿性能具有明显的影响。The copper-based microstructure surface was fabricated by redox reaction of ferric chloride and cop- per. The surface exhibited excellent superhydrophobic properties after surface treatment with lauric acid, and the contact angle of water on the surface was up to 161.6°. The surface microstructure and the superhydrophobic prop- erties were affected by the etching time. With the increase of etching time, the microstructure on the surface gradu- ally formed and increased. The contact angle of water was gradually increased, and then became stable. The effects of the etchant concentration, the species and concentration of modifying agent, and the modifying time are also in- vestigated. It＇s shown that the above reaction and modification conditions have significant impacts on the wetting properties of the copper surface.

关 键 词：超疏水表面 铜 氧化还原 接触角 

分 类 号：O647.5[理学—物理化学]