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机构地区:[1]泰山职业技术学院 [2]泰安普惠电子科技有限公司
出 处:《电子技术(上海)》2013年第4期57-59,共3页Electronic Technology
基 金:国家科技部中小企业科技创新基金(编号11c26213705042)
摘 要:为满足贴片封装LED元件焊接时温度的要求,设计了一种智能LED回流焊机温控系统。硬件部分,用LPC2148和传感器DS18B20为核心组成温度测量及控制系统,再通过液晶显示屏(128×64)将其所处的状态及实时温度曲线显示出来。软件部分,用嵌入式实时操作系统μC/OS-II,搭建了一个任务管理平台,可以克服传统的采用前后台控制和中断响应方式所难以很好解决的实时响应差、控制效率低的缺点。实际运行结果表明该系统稳定性好,可靠性高,维护简单。In order to meet the welding temperature requirements of SMD package LED element, an intelligent LED reflow soldering temperature control system is designed. The hardware part adopts LPC2148 and DS18B20 sensor as the core component to compose temperature measurement and control system, and uses LCD((128 × 64) to display its state and real-time temperature curve. The software part uses the embedded real-time operating system, C/OS-II to set up a task management platform, and it can overcome the shortcomings of poor real time response and low control efficiency which the traditional method using front and back control and interrupting response mode is difficult to solve. The practical operation results show that the system has good stability, high reliability, and simple maintenance.
分 类 号:TP334.7[自动化与计算机技术—计算机系统结构]
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