固体接触界面扩散弹道热传输  

THERMAL BALLISTIC-DIFFUSIVE TRANSPORT BETWEEN SOLID-SOLID CONTACT INTERFACE

作　　者：石零[1] 吴钢[2] 余新明[1] 

机构地区：[1]江汉大学化学与环境工程学院,武汉430056 [2]海军工程大学机械工程系,武汉430033

出　　处：《低温物理学报》2013年第3期192-196,共5页Low Temperature Physical Letters

基　　金：国家自然科学基金资助项目(批准号:51076165);湖北省教育厅科学技术研究项目(批准号:B20114502)资助的课题~~

摘　　要：固体接触界面热阻,因具有微结构多尺度依赖效应性,是接触热传导理论和工程技术所面临的一个难题.论文通过区分接触界面和亚表面层两部分物理构成,以热载子界面层扩散和弹道传递为基础,由辐射衰减结合扩散方程确定热载子扩散-弹道传递系数,建立了固体接触界面层扩散弹道热阻预测模型,并使用模型对YBCO和MgO构成的膜基界面接触热阻进行了预测分析.分析表明,在高温范围内扩散弹道热阻模型较声失配模型更接近实验值.界面层热阻扩散弹道模型能为固体接触界面层热阻分析和热控设计提供帮助.The thermal contact interface resistance is a key technical problem in many fields, because of its features of the dependence of the multi-scale and micro-structure. With device or structure characteristic length scales becoming comparable to the mean free path and wavelength of heat carriers, classical Fouerier laws are no longer valid and new approach must be taken to develop. Based on diffusive and ballistic transport of the heat carrier, made a distinction between interface and sub-surface for interface layer, the transfer coefficient was solved using the radiation attenuation equations, and a diffusive-ballistic model was built up to predict the thermal contact interface layer resistance. The analysis shows that the diffusive-ballistic model is more precise comparing with the acoustic diffusive model in the higher temperature for the thermal contact interface layer resistance prediction of the thin film of YBCO on MgO substrate. It is useful to analyze the thermal contact interface layer resistance using the diffusive-ballistic model.

关 键 词：微结构传热输 扩散弹道模型 界面热阻 接触热传输 

分 类 号：O551.3[理学—热学与物质分子运动论]