Cu含量对脉冲偏压电弧离子镀TiN-Cu纳米复合薄膜硬度的影响  

Effect of copper content on the hardness of pulsed bias arc ion plating TiN-Cu nanocomposite films

作　　者：魏科科[1] 林菁菁[1,2] 张林[1] 韩克昌[1] 林国强[1] 

机构地区：[1]大连理工大学三束材料改性教育部重点实验室,辽宁大连116024 [2]大连理工大学化工学院,辽宁大连116024

出　　处：《真空》2013年第3期52-56,共5页Vacuum

摘　　要：用脉冲偏压电弧离子镀技术在高速钢(HSS)基体上制备了一系列不同Cu含量的TiN-Cu纳米复合薄膜,用EPMA、SEM、GIXRD和纳米压痕等方法分别测试了薄膜的成分、形貌、相组成、硬度和弹性模量,重点考察薄膜成分对其硬度和弹性模量的影响。结果表明,Cu含量对薄膜的硬度和弹性模量影响显著,随着Cu含量的增加,薄膜硬度和弹性模量先增大后减小,在Cu含量为1.28 at%时,硬度和弹性模量达到最大值,分别为45.0 GPa和562.0 GPa。最后对TiN-Cu纳米复合薄膜的非晶-纳米晶强化机制进行了讨论。TiN-Cu nanocomposite films with different copper contents were deposited by pulsed bias arc ion plating （AIP） on HSS substrates. The composition, morphology, phase composition, hardness and elastic modulus of the films were respectively investigated by electron probe microanalysis （EPMA）, scanning electron microscope （SEM）, grazing incidence X-ray diffraction analysis （GIXRD） and nano indenter. The influence of composition on the hardness and elastic modulus of the films was specially studied. The results show that the Cu content has a significant impact on the hardness and elastic modulus of the films. With the increase of the Cu content, the hardness and elastic modulus of the films increase first and then decrease. When the Cu content is 1.28at%, the hardness and elastic modulus reach their maximum, respectively 45.0GPa and 562.0GPa. Finally, the amorphous- nanocrystalline strengthening mechanism of TiN-Cu nanocomposite film was highly discussed.

关 键 词：脉冲偏压电弧离子镀 TiN—Cu纳米复合薄膜 硬度 弹性模量 强化机制 

分 类 号：TG174.444[金属学及工艺—金属表面处理]