工艺参数对超声波电沉积Cu-SiO_2复合镀层结构与硬度的影响  

Effects of Process Parameters on Structure and Hardness of Cu-SiO_2 Composite Coating Prepared by Ultrasonic Electrodeposition

作　　者：曹玉瑞[1] 赵纪青[1] 

机构地区：[1]鹤壁职业技术学院电子信息工程学院,河南鹤壁458030

出　　处：《电镀与环保》2013年第3期10-12,共3页Electroplating & Pollution Control

摘　　要：基于超声波电沉积法制备Cu-SiO2复合镀层,并研究了超声波功率和阴极电流密度对复合镀层结构与硬度的影响。结果表明:复合镀层的结构随超声波功率的增大(0～500W)先改善后恶化,而随阴极电流密度的增加(3～18A/dm2)渐趋稀松;复合镀层的硬度随超声波功率的增大和阴极电流密度的增加均呈现出先升高后降低的趋势。The Cu SiO2 composite coating was prepared by ultrasonic electrodeposition, and the effects of ultrasonic power and cathode current density on its structure and hardness were studied. The results show that the structure of the coating is improved first and then deteriorated with the increasing of ultrasonic power （from 0 to 500 W）, and it gradually becomes coarse and loose as cathode current density changes from 3 to 18 A/dm^2. The hardness of the composite coating tends to increase first and then decrease with the increasing of ultrasonic power and cathode current density.

关 键 词：复合镀层 结构 硬度 超声波功率 阴极电流密度 

分 类 号：TQ153[化学工程—电化学工业]