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机构地区:[1]太原理工大学新材料界面科学与工程教育部重点实验室,山西太原030024
出 处:《稀有金属材料与工程》2013年第5期993-997,共5页Rare Metal Materials and Engineering
基 金:国家自然科学基金(50901048);教育部新世纪优秀人才支持计划;山西省自然科学基金(2010021022-5);凝固技术国家重点实验室(西北工业大学)开放基金(SKLSP201003)
摘 要:配制有机非质子极性溶剂EtMgCl/THF溶液作为镁电沉积电解液,采用循环伏安法对镁薄膜在基体铜上的初始电化学沉积行为做了研究,结果表明,镁薄膜的电沉积行为遵循形核/生长机制;采用直流沉积法,分别改变电解液浓度和电流密度,得到光亮致密均匀的镁镀层;利用SEM和XRD分别对镀层表面形貌和相组成进行了表征;采用脉冲电沉积法制得金属镁镀层,与恒流电沉积相比,脉冲电沉积能够细化晶粒,并存在着[002]面的择优取向。Organic aprotic polar solvent EtMgCl/THF solution was prepared as magnesium electrodeposition electrolyte, and the initial electrochemical deposition of Mg film electrodeposited on Cu matrix was investigated by cyclic voltammetry (CV). The results show that the deposition of Mg film follows the mechanism of nucleation and subsequent grain growth. The bright, compact and uniform coating of magnesium was obtained by DC (direct current) deposition for changing the electrolyte concentration and current density. The surface morphology and phase composition of the coating were characterized by D8 XRD and SEM respectively. Compared with DC, the grain size by PC (pulse current) are more finer, and the results manifest a preferential orientation of the Mg crystallites parallel to the [002] crystallographic planes.
分 类 号:TG174.4[金属学及工艺—金属表面处理]
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