电子塑封模技术概要  

The Technology Summary About Electronic Packing Mold

作　　者：汪宗华 

机构地区：[1]安徽铜陵三佳山田科技有限公司技术开发部,安徽铜陵244000

出　　处：《模具制造》2013年第6期58-60,共3页Die & Mould Manufacture

摘　　要：电子塑料封装模具是制造电子元器件后道工序的关键设备,本文介绍了电子封装专用模具基本结构、工作原理,指出电子塑料封装模具设计时注意事项,成型镶件、两端管脚防变形、减小闭模压力等核心零部件设计要点、计算公式;同时系统的介绍了电子塑料封装模具各部件功能、作用、设计原则,为行业内人士了解电子塑料封装模具技术要素提供了依据、有益参考,对电子塑料封装模具设计人员具有一定的指导意义。The electronic is the key equipment for the back-end of semiconductor manufacture, this article introduce the basic structure and the work principle about it, at the same time, This article state that the design considerations of electronic packing mold. On the other hand, this paper introduce the components feature, the function and design principles for the electronic packing mold. This article supply the basis and useful reference for industry insiders to know electronic packing mold technology factors.

关 键 词：电子塑封模 热胀匹配 防漏料 浇道系统 模架部件 

分 类 号：TN405[电子电信—微电子学与固体电子学]