硅材线锯切割过程中的温度分析  

Finite Element Simulation of the Silicon Wiresaw Temperature Field

作　　者：徐宗华[1] 姚春燕[1] 彭伟[1] 李晓佳[1] 陈思源[1] 

机构地区：[1]特种装备制造与先进加工技术教育部/浙江省重点实验室(浙江工业大学),浙江杭州310014

出　　处：《机械设计与制造工程》2013年第3期66-69,73,共5页Machine Design and Manufacturing Engineering

基　　金：国家自然科学基金资助项目(51075367);浙江省自然科学基金资助项目(Y1090931)

摘　　要：为了更有效地控制硅材在线锯切割过程中因温度变化而引起的材料翘曲变形,采用流体力学的前处理软件建模及对模型进行网格划分,对硅材与磨浆的流固耦合系统的温度进行了CFD分析,此外还分析了磨浆进口速度和进口温度对硅材温度分布的影响。结果表明,硅材和磨浆的温度在线走丝方向上逐渐升高,到出口附近最高,增大磨浆的进口速度或减小磨浆的进口温度,有利于降低硅材在切割过程中的温度。In order to avoid the bow and warp on silicon ingot from temperature variation during slicing, it introduces the importance of the temperature control during silicon slicing, applies CFD to simulate the temperature filed of fluid and silicon ingot in the fluid -solid coupling system. The temperature distribution and profile through vertical section of silicon wafer is obtained in different fluid inlet speed and temperature respectively. The results show that the temperature of the silicon and fluid increases along the wire direction and reaches maximum near the outlet, higher speed and lower temperature of the inlet fluid both helps to reduce the silicon temperature during slicing.

关 键 词：硅材切割 流固耦合 温度分析 

分 类 号：TP319[自动化与计算机技术—计算机软件与理论]