基于截面显微法的光学材料亚表面损伤检测  

Subsurface Damage Detection of Optical Materials Based on Transversal Surface Microscopy

作　　者：汉语[1] 刘成有[1] 张勇[1] 崔舒[1] 徐井华[1] 

机构地区：[1]通化师范学院物理学院,吉林通化134002

出　　处：《通化师范学院学报》2013年第4期19-20,共2页Journal of Tonghua Normal University

基　　金：吉林省教育厅"十二五"科学技术研究项目(2013.386)

摘　　要：针对光学材料亚表面损伤的截面显微法检测进行了深入研究.介绍了截面显微法的基本原理以及样品制备和检测工艺流程,并对检测结果进行了分析,得出了亚表面裂纹深度与磨料粒度之间的比例关系.A transversal surface microscopy method was presented in this paper to measure the subsurface damage of optical materials.The basic principle of this method was given and the testing result was analyzed.A proportional relationship between sub-surface crack depth and particle size of SIC abrasive was established.

关 键 词：光学材料 研磨 亚表面损伤 截面显微法 

分 类 号：TG580.6[金属学及工艺—金属切削加工及机床]