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作 者:陆业航[1] 李晋炜[1] 张庆云[1] 姚罡[1]
出 处:《理化检验(物理分册)》2013年第5期286-288,292,共4页Physical Testing and Chemical Analysis(Part A:Physical Testing)
摘 要:对Ti60/TC17异种材料进行电子束焊接,研究接头成型特点、焊缝组织、热影响区组织及显微硬度。结果表明:Ti60/TC17电子束焊接接头的焊缝组织为对称生长的枝晶状组织;Ti60侧热影响区与焊缝有明显分界,组织为针状α相;TC17侧热影响区为细小的粒状α相。焊缝的显微硬度低于母材的显微硬度。The joints of Ti60 and TC17 are welded by electron beam welding, the macrostructure, microstructure and microhardness of the joints were analyzed. The results showed that the microstructure of the welding seam was consisted of the symmetric dendrites; and the microstructure of heat affected zone near Ti60 side was speculate a phase, which had a clear boundary with a welding line; and TC17 side was consisted of fine granular phase. The hardness of the welding seam was higher than that of the base metal.
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