纳米压痕法确定金属间化合物力学性能的研究  

Determination of mechanical properties for intermetallic compound by nanoindentation

作　　者：肖革胜[1] 杨雪霞[1] 袁国政[1] 树学峰[1] 

机构地区：[1]太原理工大学应用力学与生物医学工程研究所,太原030024

出　　处：《应用力学学报》2013年第3期334-338,472,共5页Chinese Journal of Applied Mechanics

基　　金：国家自然科学基金(11172195);山西省国际科技合作项目(2010081016)

摘　　要：利用SMT全自动回流焊机和高温恒温试验箱制备出经2次回流焊时效处理20天的Sn-0.7Cu/Cu焊点试件;采用纳米压入法对其焊点金属间化合物力学性能进行了测试,根据Oliver-Pharr算法,利用接触刚度连续测量技术得到了该化合物(IMC)的杨氏模量及硬度,其硬度为6.43GPa,明显大于同种工况下Cu(2.29GPa)和Sn-0.7Cu(0.32GPa)的硬度;与此同时利用有限元分析软件ANSYS对纳米压入过程进行了反分析,结果表明:与理想弹塑性模型相比,线性强化弹塑性模型能够更准确地描述IMC层的力学本构关系,其初始屈服应力σ0和切线模量EΤ分别为0.90GPa和14.5GPa。In this paper the Sn-0.7Cu/Cu solder joint subject to 2 reflows and 20d aging is presented using SMT full-automatic reflow machine and high-constant temperature test chamber,then the IMC(intermetallic compound) mechanical properties of the solder joint are measured by using nano-indentation method.Based on the calculation method given by Oliver-Pharr and the continuous stiffness measurement(CSM),the Young's modulus and hardness of IMC are found.Comparison and analysis of mechanical properties between IMC and Sn-0.7Cu/Cu are carried out,results show that the hardness of IMC(6.43GPa) is significantly greater than those of Cu(2.29GPa) and Sn-0.7Cu(0.32GPa).The indentation process is simulated with the ANSYS finite element code,then linear strengthening elastic-plastic constitutive relation of IMC is gained from a series of numerical simulations using the inverse analysis method,the initial yield stress 0 σ and tangent modulus E Τ are 0.90GPa and 14.5GPa respectively.

关 键 词：金属间化合物 有限元分析 力学性能 纳米压痕 弹塑性本构 

分 类 号：O34[理学—固体力学]