热塑性聚酰亚胺改性聚醚醚酮树脂的力学性能研究  

Study on Mechanical Properties of Thermoplastic Polyimide Modified Polyether Ether Ketone Resin

作　　者：王运良[1] 陈春海[2] 

机构地区：[1]佳木斯大学药学院,黑龙江佳木斯154007 [2]吉林大学麦克德尔米德实验室,吉林长春130012

出　　处：《佳木斯大学学报（自然科学版）》2013年第3期402-405,共4页Journal of Jiamusi University：Natural Science Edition

摘　　要：聚醚醚酮的玻璃化转变温度较低,即使是结晶度很高的聚醚醚酮树脂,其在200℃以上也会发生严重的软化,限制了这类树脂材料在较高温度段的使用性能,可以通过材料改性的方法来提升聚醚醚酮树脂的使用温度,改善其高温段使用性能.聚酰亚胺(PI)由于主链中高含量的芳杂环具有优异的热稳定性和很高的使用温度.其中热塑性聚酰亚胺(TPI)除了具有与一般聚酰亚胺材料相似的耐温等级和电气性能以外,还同时具有良好的热加工性能.将二者进行熔融共混加工成型,测试其力学性能,表明改性树脂的耐热性优于PEEK,可以提升PEEK的高温使用性能.The glass transition temperature of PEEK is very low. Even if the crystallization of PEEK resin degree is very high, it will serious soften in above 200 ℃, which limited the use of this type of resin materials in temperature. The material modification methods were used to improve temperature poly ether ketone resin and the high temperature performance. Due to the high content of aromatic heterocyclic, polyimide （PI） is of excellent thermal stability and high service temperature. Besides the level of temperature and electrical resistance of poly- imide materials with similar hot outside, the thermoplastic polyimide （TPI） is of good processing performance. The PI and TPI were melt and blended and processed into shape. Its mechanical properties show that the heat re- sistance the modified resin is better than that of PEEK. The performance of PEEK at high temperature can in- crease.

关 键 词：热塑性聚酰亚胺 改性 聚醚醚酮树脂 力学性能 

分 类 号：TQ326.5[化学工程—合成树脂塑料工业]