化学镀银在复合粉体中的应用及研究进展  

Application and Research Progress of Electroless Silver Plating in Composite Powders

作　　者：李文良[1] 赵奇金[1] 方政秋[1] 

机构地区：[1]北京有色金属研究总院矿物资源与冶金材料研究所,北京100088

出　　处：《电镀与精饰》2013年第6期16-20,25,共6页Plating & Finishing

基　　金：北京有色金属研究总院青年基金资助项目53107(2011)

摘　　要：介绍了复合粉体化学镀银的原理和特点。分析了粉体的类型、粉体的预处理工艺、化学镀液成分及操作条件如温度、pH等因素对化学镀银的影响。综述了镀银粉体在导电填料、吸波材料和电子元件方面的应用和研究现状,并提出了粉体化学镀银目前存在的问题和未来的发展趋势。The principle and characteristics of electroless silver plating were introduced.The factors affecting electroless silver plating on powders were analyzed,including the type of powder,pretreatment,bath composition and operating conditions such as temperature and pH.The application and research status of silver plating powders in conductive filler,microwave absorbing materials and electronic materials were summarized.And the existing problems and development were put forward.

关 键 词：化学镀银 复合粉体 影响因素 应用 

分 类 号：TQ153.16[化学工程—电化学工业]