Compact Thermosyphon Heat Exchanger for Power Electronics Cooling  

作　　者：Bruno Agostini Mathieu Habert 

机构地区：[1]ABB Ltd. Switzerland, Corporate Research, Daettwi15405, Switzerland

出　　处：《Journal of Energy and Power Engineering》2013年第5期972-978,共7页能源与动力工程（美国大卫英文）

摘　　要：The heat losses density in power electronics products follows an ever increasing trend. Nowadays they reach 200 W/cmz at chip level and 50 W/cm2 at heatsink base level. Water cooling is the most effective cooling method but unfortunately water is often undesired due to high voltages or costumer requirements. Two-phase cooling is a promising technology for electronics cooling. It allows using dielectric fluids in passive systems and still benefits from very high heat transfer coefficients. Thermosyphons are a particularly interesting technology in the field of power electronics because it is entirely passive and a simple equipment. ABB has developed a compact thermosyphon heat exchanger based on automotive technology, which uses numerous multi-port extruded tubes with capillary sized channels disposed in parallel and brazed to a heated base plate in order to achieve the desired compactness. The experimental performances of this novel power electronics cooling system are presented with R134a as a working fluid. The influence of several parameters on the performances was studied experimentally： coolant flow rate, coolant temperature, heat load and fluid filling.

关 键 词：THERMOSYPHON heat pipe power electronics. 

分 类 号：TQ051.61[化学工程] TN322.8[电子电信—物理电子学]