粉体化学镀银的研究进展  

Research Progress of Electroless Silver Plating on Powders

作　　者：黄茜[1] 黄惠[1] 赖耀斌[1] 郭忠诚[1,2] 

机构地区：[1]昆明理工大学冶金与能源工程学院,云南昆明650093 [2]昆明理工恒达科技有限公司,云南昆明650106

出　　处：《材料保护》2013年第6期46-50,8,共5页Materials Protection

摘　　要：介绍了化学镀银的机理;阐述了近年化学镀银在金属粉体、无机非金属粉体和有机高分子粉体方面的研究进展,以及还原剂、温度、镀液pH值、镀液配制工艺、外力场等因素对粉体化学镀银过程中粉体分散性、镀层性能的影响;提出了粉体化学镀银存在的问题及今后的研究方向。A review was provided of the research progress of electroless silver plating on powders.The mechanism of electroless silver plating was introduced,and the progress in electroless silver plating of metal powders,inorganic non-metallic powders and organic polymer powders in recent years was briefed.Furthermore,the influences of reducing agents,bath temperature,bath pH value,process for preparing bath,and external forces on the dispersibility of the powders and performance of electroless Ag coating were discussed.Moreover,suggestions were also given about existent problems and development trend of electroless silver plating.

关 键 词：化学镀银 粉体 影响因素 

分 类 号：TQ153.1[化学工程—电化学工业]