微电子产品防静电包装材料的研究进展  

Development Progress of Anti-static Packaging Material for Microelectronic Products

作　　者：张晓玉[1] 袁玉珍[1] 

机构地区：[1]山东理工大学,淄博255000

出　　处：《包装工程》2013年第13期117-122,共6页Packaging Engineering

基　　金：山东理工大学重大横向课题(9002-109701)

摘　　要：首先叙述了防静电包装与防静电包装材料的概念,对微电子产品的防静电包装设计进行了介绍,并分别讨论了不同种类的抗静电包装材料的特点,简述了微电子产品包装国内外的发展情况,最后指出了微电子产品防静电包装的发展趋势与良好的市场前景。The concept of anti-static packaging and anti-static packaging material were first described. Anti-static packaging design for microelectronic products was introduced. The characteristics of different types of anti-static packa- ging material were discussed. Development status of anti-static packaging for microelectronic products at home and a- broad was introduced. Development trend and market prospects of anti-static packaging for microelectronic products were put forward.

关 键 词：微电子产品 防静电设计 包装材料 抗静电剂 

分 类 号：TB484[一般工业技术—包装工程]