Sn-Sb15无铅焊料熔体结构转变及其对凝固和润湿性的影响  

Structure Transition of Lead-Free Sn-Sb15 Solder and Its Effects on Solidification and Wettability

作　　者：董野峰[1] 李先芬[1] 祖方遒[1] 刘兰俊[1] 赵雪梅[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《金属功能材料》2013年第3期1-5,共5页Metallic Functional Materials

基　　金：国家自然科学基金资助项目(50571033);安徽省自然科学基金(070416234)

摘　　要：在高达1 200℃的范围内,通过直流四电极法研究了Sn-Sb15无铅焊料合金在液相线以上一定温度范围内发生熔体结构转变的可能性及规律,并以此为切入点研究了熔体结构转变前后焊料的凝固组织和润湿性能的变化规律。研究表明:Sn-Sb15合金熔体发生了温度诱导的液态结构转变;这种转变细化了凝固组织、改善了Sn-Sb合金钎料的润湿性能。The possibility and rule of liquid structure transition of Sn-Sbl5 lead-free solder were studyed by DC four - electrode method within liquidus to 1200 ℃. The variation of solidification structure and wetting properties of the solder were studied. The results showed that temperature-induced liquid structural of the molten Sn-Sbl5 alloy were changed. The refinement of solidification structure and improvement of wettability of Sn-Sb filler metal were produced by these changes.

关 键 词：Sn-Sb无铅焊料 电阻率 润湿性 凝固 

分 类 号：TG42[金属学及工艺—焊接]