六次甲基四胺对铝箔化学腐蚀扩容过程的影响  

Effects of methenamine on aluminium foil chemical etching process

作　　者：秦毅红[1] 玉日泉[1] 蔡湘孟[1] 聂成肖[1] 

机构地区：[1]中南大学冶金科学与工程学院,湖南长沙410083

出　　处：《电子元件与材料》2013年第7期25-28,40,共5页Electronic Components And Materials

摘　　要：利用添加了六次甲基四胺的盐酸-硫酸体系对铝合金箔进行腐蚀,采用扫描电镜观察、循环伏安法计算,研究了六次甲基四胺的添加浓度、腐蚀温度及腐蚀时间对腐蚀后铝合金箔表面状况及面积比容量的影响。结果表明:当在成分为2.0 mol/L HCl+0.2 mol/L H2SO4的腐蚀液中添加0.1 g/L六次甲基四胺,腐蚀温度为55℃,腐蚀时间为70 s时,腐蚀后的铝合金箔表面呈海绵状腐蚀孔,面积比容量为268.5×10–6F/cm2,较未添加六甲基四胺时提高了约20%。Aluminium alloy foil was etched in HCI-H2SO4 solution with the addition of methenamine （HMTA）. The effects of the concentration of methenamine （HMTA）, etching temperature and etching duration on aluminium foil corrosion process were investigated. The morphology of aluminium alloy foil and the specific capacitance were studied by scanning electron microscope （SEM） and cyclic voltammetry （CV）, respectively. The results show that, under the following conditions： the mass concentration of HMTA in an etching solution of 2.0 mol/L HCI＋0.2 mol/L H2SO4 is 0.1 g/L, the etching temperature of 55 ~C, the etching time of 70 s, homogeneous sponge-like corrosion holes are presented on the surface of the etched aluminium alloy foil and the specific capacitance of the etched aluminium alloy foil is 268.5× 10-6 F/cm2, which is 20% higher than that of without HMTA.

关 键 词：六次甲基四胺 盐酸-硫酸体系 铝合金箔 缓蚀作用 比容量 扫描电镜 循环伏安法 

分 类 号：TM535[电气工程—电器]