陶瓷电子元件局部化学镀铜电极的性能及结构  

Performance and structure of electrodes on ceramic-based electronic component by localized electroless copper plating

作　　者：雷俊玲[1] 张巧丽[1] 郑帅[1] 刘炳泗[1] 

机构地区：[1]天津大学理学院化学系,天津300072

出　　处：《电子元件与材料》2013年第7期57-59,共3页Electronic Components And Materials

基　　金：国家自然科学基金和宝钢联合基金资助项目(No.50876122);地方企业基金资助项目(No.G207637)

摘　　要：采用含钯的催化浆料活化法,实现了陶瓷表面的局部化学镀铜。扫描电子显微镜观察结果表明均匀分散的钯纳米颗粒起到了催化铜沉积的作用,镀铜层光滑平整、颗粒大小均匀。X-射线光电子能谱(XPS)和X-射线衍射(XRD)测试结果表明镀层是具有晶态结构的纯铜镀层。对化学镀铜后的陶瓷电子元件进行物理性能和电性能测试,其结果均满足工业要求。The localized electroless copper plating on the surface of ceramics was realized by activation method using catalytic paste containing palladium. It could be seen from scanning electron microscope （SEM） that palladium nanoparticles are uniformly dispersed on the surface of ceramics as nucleation centers in the deposition of copper. The copper layer presentes smooth with uniform particle size. The results characterized by X-ray photoelectron spectroscopy （XPS） and X-ray diffraction （XRD） show that the films are pure copper coatings with a typical crystal structure. The physical properties and electronic performance of prepared electronic components all meet the industrial requirements.

关 键 词：电子元件 钯纳米颗粒 陶瓷 催化浆料 局部化学镀铜 晶体结构 

分 类 号：TM283[一般工业技术—材料科学与工程]