直接法聚酰亚胺覆铜箔的制备  

Preparation of Polyimide Copper Clad Laminate by Direct Method

作　　者：范福庭[1] 朱小华[1] 沈晓成[1] 

机构地区：[1]上海市合成树脂研究所,上海200235

出　　处：《高分子材料科学与工程》2013年第7期166-169,174,共5页Polymer Materials Science & Engineering

摘　　要：以2,2′-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)、对苯二胺(PDA)和4,4’-联苯四甲酸二酐(BPDA)为原料,采用共聚法合成了聚酰胺酸(PAA)树脂;然后将PAA树脂涂布到电解铜箔表面上,在高纯氮气保护下进行热亚胺化处理,最后制备出一种表观平整、光滑的聚酰亚胺(PI)覆铜箔。研究了BAPP/PDA物质的量比、PAA树脂的预固化工艺和热亚胺化工艺以及收卷牵引力对PI性能的影响。结果表明,BAPP/PDA物质的量比为1.5/4.5,PAA树脂预固化时涂布速度为0.6m/min、烘道长度为9m、烘道温度分布为110℃、140、170℃,PAA树脂热亚胺化工艺为200℃/1h、250℃/1h、320℃/2h和收卷牵引力为14kg^16kg时,所制备的PI覆铜箔性能较佳。With 2,2-bis [ 4- （4-amino-phenoxy） phenyl ] propane （BAPP）, p-phenylenediamine （PDA） and 4,4 ＇ biphenyl dianhydride （BPDA） as main raw materials, polyamic acid （PAA） resin was synthesized by copolymerizatiorL Then, PAA resin was coated on the surface of electrolytic copper foil and imidized at high temperature under high purity nitrogen protection. A flat, smooth and flexible polyimide copper clad laminate was finally prepared. The properties of PI copper clad laminate with different molar ratio of BAPP./PDA, pre-curing process and thermal imidization process of PAA resin, winding traction of coating machine were studied. The results show that PI copper clad laminate with better comprehensive properties was prepared with the molar ratio of BAPP/ PDA 1.5/4.5, under the pre-curing process of PAA resin, such as the coating speed is 0.6m/min, the length of the drying tunnel is 9m, the temperature distribution of drying tunnel is 110 ℃, 140 ℃, 170 ℃, the thermal imidization process is 200 ℃/lh,250 ℃/lh,320 ℃/2h and windin traction is 14k-16kg.

关 键 词：聚酰胺酸树脂 热亚胺化 氮气保护 聚酰亚胺覆铜箔 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]