关于低锡青铜电镀的几个问题  

Comments on Low Tin Bronze Plating

作　　者：唐春华 

出　　处：《电镀与涂饰》1991年第4期26-29,共4页Electroplating & Finishing

摘　　要：总结了常规低锡青铜电镀工艺的改进如提高无氰镀液的稳定性,以低氰槽液代替高氰槽液,以化学抛光取代机械抛光,以电解退镀代替化学退镀等.对光亮低锡青铜工艺也作了阐述.Recent improvements on conventional low tin bronze plating process were summarized with stresses on the way to improve the stability of non-cyanide baths and the suggestions of substituting high cyanide concentration baths by the lower cyanide concentration ones, using chemical polishing process instead of mechanical polishing process, and electrolytic stripping process instead of chemical one. Comments on birght bronze plating process were also presented.

关 键 词：电镀 低锡青铜 

分 类 号：TQ153.2[化学工程—电化学工业]