KDP晶体塑性域切削技术研究  

Research on the cutting technology for KDP crystal in ductile mode

作　　者：葛继强[1] 陈金明[1] 吉方[1] 刘兴宝[1] 

机构地区：[1]中国工程物理研究院机械制造工艺研究所,绵阳621900

出　　处：《现代制造工程》2013年第7期133-137,共5页Modern Manufacturing Engineering

摘　　要：通过对KDP晶体等脆性材料压痕实验中的塑性行为分析,说明了实现KDP晶体等脆性材料塑性域切削的可行性。通过对脆性材料的切削模型进行分析,阐明了刀具几何尺寸以及切削用量对KDP晶体切削过程的影响。分析已有模型的不足,同时提出了从微观角度建立材料脆性断裂判据,以完善KDP晶体塑性域切削机理的研究思路。Through the analysis on the ductile behavior in the indentation experiment of brittle materials such as KDP crystal, con- elude that those brittle materials could largely be cut in ductile mode. Through analysis on the cutting model of brittle material, express the effects of geometry sizes of the cutter and the cutting amount on the cutting process. Then put forward the insufficient of the model and so is the research thinking of creating a fracture criterion for the brittle material to perfect the KDP cutting mechanism in duetile mode in microcosmic view.

关 键 词：KDP晶体 脆性材料 塑性域切削 

分 类 号：TP391[自动化与计算机技术—计算机应用技术]