新型Cu/Pd复合电触点材料  

A Study of Novel Copper/Palladium Composite Materials for Electric Contacts

作　　者：卢峰[1] 

机构地区：[1]昆明贵金属研究所,中国昆明650221

出　　处：《贵金属》2000年第3期1-7,共7页Precious Metals

摘　　要：研究制备Cu/Pd2 5、Cu/Pd30 、Cu/Pd40 和Cu/Pd60 (wt% )复合材料并测量它们的力学及电学性能 ,利用金相显微镜和扫描电镜观察了复合材料的组织结构 ,对不同Pd含量的Cu/Pd复合材料的性能进行比较。这类新型Cu/Pd复合材料显示出优异的可加工性、适中的硬度和非常高的电导率 ,是目前世界上最好的直流触点材料之一。Some Cu/Pd composite materials-Cu/Pd 25 ,Cu/Pd 30 ,Cu/Pd 40 and Cu/Pd 60 (wt%)were prepared.Their mechanical and electrical properties were measured.Their structural characteristics were observed under the metallographic microscope and scanning electron microscope.The comparison of the properties was made among the composite materials with different palladium content.The new materials exhibit excellent ductility,appropriate hardness and very high electrical conductivity.The Cu/Pd composite materials are one of the best DC contact materials in the world until now.

关 键 词：电触点 Cu/Pb 合材料 性能 直流触头材料 

分 类 号：TM241[一般工业技术—材料科学与工程] TB331[电气工程—电工理论与新技术]