Cu的化学共沉积对Ni-P合金结构和热稳定性的影响  

Effects of Codeposition of Cu on Microstructure and Thermal Stability of Electroless Ni-P Coatings

作　　者：蒋太祥[1] 吴辉煌[1] 

机构地区：[1]厦门大学化学系

出　　处：《应用化学》2000年第5期578-580,共3页Chinese Journal of Applied Chemistry

摘　　要：The electroless Ni-Cu-P coatings with different Cu content have been deposited from alkaline bath. The surface morphology, microstructure and crystallization behaviour of the electroless Ni-Cu-P alloys have been studied by SEM, XRD and DSC. The results show that the concentration of CuSO4·5H2O in the bath has a great effect on the composition of the deposits and the deposition rate. The codeposition of a small amount of Cu makes the crystal grains of the deposits become smaller, but with the Cu content increasing, the deposits exhibit a larger grain size and a more coarse surface morphology. The thermal stability of Ni-Cu-P deposit increases with the Cu content increasing in the deposits.The electroless Ni-Cu-P coatings with different Cu content have been deposited from alkaline bath. The surface morphology, microstructure and crystallization behaviour of the electroless Ni-Cu-P alloys have been studied by SEM, XRD and DSC. The results show that the concentration of CuSO_4·5H_2O in the bath has a great effect on the composition of the deposits and the deposition rate. The codeposition of a small amount of Cu makes the crystal grains of the deposits become smaller, but with the Cu content increasing, the deposits exhibit a larger grain size and a more coarse surface morphology. The thermal stability of Ni-Cu-P deposit increases with the Cu content increasing in the deposits.

关 键 词：化学镀 镍铜磷合金 微观结构 热稳定性 电镀 

分 类 号：TQ153.2[化学工程—电化学工业]