微结构传感器芯片划切工艺优化  

Optimizing on dicing process of micro sensor chip

作　　者：王江[1] 陈苗岐[1] 

机构地区：[1]中国电子科技集团公司第四十九研究所芯片与微系统工程中心,哈尔滨150001

出　　处：《信息技术》2013年第7期182-184,共3页Information Technology

摘　　要：MEMS传感器技术的发展,伴随着新结构、新材料、新工艺应用在晶圆制造中[1]。这对封装核心工序的划片工艺提出了很大挑战。主要通过芯片划切过程中容易出现的几个异常现象对微结构敏感芯片划切过程中的破片进行分析,提出了一些解决微结构芯片划切过程中存在问题的办法,并进行了划切参数的优化。With the development of MEMS sensor technology, new structure, material and process are adopted in the fabrication of chips. As one of the important steps of MEMS package, the seperation of chips is facing great challenge. In order to know the reason of the breaking micro structure chips, several unwanted phenomenons of dicing process are discussed. To solve the problems existing in the process of MEMS chip dicing, several methods are presented and the dicing parameters are optimized.

关 键 词：划切 芯片 优化 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]