化学镀Ni-Cu-P工艺的研究  

A Study of Electroless Ni-Cu-P Plating Process

作　　者：梁耀升[1] 刘飞华[1] 费克勋[1] 

机构地区：[1]苏州热工研究院有限公司,江苏苏州215000

出　　处：《电镀与环保》2013年第4期17-19,共3页Electroplating & Pollution Control

摘　　要：采用碱性溶液在纯铜表面化学镀Ni-Cu-P。研究了主盐、还原剂、pH值及温度对镀速的影响,总结了镀速随工艺参数变化的规律及机理。An alkaline solution was used to deposit a Ni-Cu-P coating on pure copper surface by electroless plating.The effects of the main salt,reducer,pH value and temperature on the deposition rate were investigated.The law and mechanism of deposition rate changing with technological parameters was summarized.

关 键 词：化学镀 NI-CU-P 镀速 

分 类 号：TQ153[化学工程—电化学工业]