电解液温度对化学镀银的影响  

Effects of Bath Temperature on Electroless Silver Plating

作　　者：郭国才[1] 徐丽娟[1] 王印印[1] 

机构地区：[1]上海应用技术学院化学与环境工程学院,上海201418

出　　处：《电镀与环保》2013年第4期19-21,共3页Electroplating & Pollution Control

摘　　要：以葡萄糖为还原剂,在玻璃表面化学镀银。研究了电解液温度对镀层沉积速率及表面形貌的影响。通过对电解液的性能及镀层的特征进行比较,得出了最佳的化学镀银工艺参数。Silver was deposited on glass surface with glucose as reductant.The effects of bath temperature on the plating rate and surface morphology of the coating were investigated.The optimal operating parameters for electroless silver plating were obtained through comparisons of bath performances and coating properties.

关 键 词：化学镀银 温度 沉积速率 表面形貌 

分 类 号：TQ153[化学工程—电化学工业]