Ag含量对Sn-Ag-Cu无铅钎料显微组织和性能的影响  

Effect of Ag content on microstructure and properties of Sn-Ag-Cu lead-free solder

作　　者：周许升[1] 乔培新[1] 龙伟民[1] 潘建军[1] 黄俊兰[1] 

机构地区：[1]郑州机械研究所新型钎焊材料与技术国家重点实验室,450001

出　　处：《焊接》2013年第6期38-41,70-71,共4页Welding & Joining

基　　金：863国家高技术研究发展计划(2012AA040208)

摘　　要：采用金相分析、拉伸试验和动电位极化法，研究了Ag含量变化对sn-Ag—cu无铅钎料显微组织、力学性能和耐腐蚀性的影响。试验结果表明：Sn-0．5Ag-0．7Cu无铅钎料显微组织中的金属间化合物（IMC）颗粒较粗大，其抗拉强度最低，随着Ag含量的增加，钎料中sn—Ag—cu三元网状共晶组织数量增加，钎料中β-Sn晶粒尺寸逐渐变小；Ag含量在0．5％～3．5％时，随着Ag含量的增加，钎料的抗拉强度逐渐提高，而断后伸长率逐渐下降；随着Ag含量的增加，钎料的腐蚀电位逐渐提高，即增加钎料中Ag的含量可以提高钎料的耐腐蚀性能。The effect of the Ag content on the microstructure,mechanical properties and corrosion resistance of Sn-Ag-Cu lead-free solder were studied.The experimental result showed that,for the solder with 0.5%Ag content,the coarse intermetallic compounds Ag_3Sn and Cu_6Sn_5form,and the solder exhibits the lowest tensile strength among the various solders.With Ag content increasing,the quantity of eutectic structure increases,and the primary β-Sn grain in the solder become finer.With Ag content increasing from 0.5%to 3.5%,the tensile strength of solder increases,while the specific elongation gradually decreases.The corrosion potential of solders increase with the increase of Ag content,and the corrosion resistance of solders is improved.

关 键 词：SN-AG-CU 无铅钎料 Ag含量 耐腐蚀性 力学性能 

分 类 号：TG425.1[金属学及工艺—焊接]