全膜电容器低熔点刮擦焊料性能的研究  

Research on the Low Melting Point Solder Used With the Aluminium Foil Scraped and Rubbed for All Film Capacitors

作　　者：王友功[1] 陈孝存 华自圭[1] 李丽琴[1] 宋琳[1] 

机构地区：[1]西安交通大学

出　　处：《电力电容器》1991年第1期23-30,共8页Power Capacitors

摘　　要：全膜电容器已成为电力电容器的发展方向,而铝箔外凸式电极结构又是其最佳选择。本文主要介绍新研制成功的铝钎焊用低熔点焊料的优良性能。用于全膜电容器,对进一步提高电容器的性能将会发挥重要作用。The all film capacitors have been the developing trend of power capacitors, and the aluminium foil salient pole is the oPtimal constructure. This article mainly introduces the excellent features of low melting Point solder which is used for aluminium soldering. This solder is the new Product researched and developed recently. By being used in all film capacitors, it will play an important effect to improve the properties of capacitors.

关 键 词：全膜电容器 低熔点钎料 铝钎焊 

分 类 号：TM531.405[电气工程—电器]