SiC_p/Al复合材料电子束焊接接头组织及性能  

Microstructure and mechanical properties of SiC_p/Al joints by electron beam welding

作　　者：陈国庆[1] 张秉刚[1] 甄公博[1] 何俊[2] 冯吉才[1] 

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001 [2]兰州空间技术物理研究所,兰州730000

出　　处：《焊接学报》2013年第7期73-76,116,共4页Transactions of The China Welding Institution

基　　金：中央高校基本科研业务费专项资金资助项目(HIT.NSRIF.2014007)

摘　　要：对SiCp/Al复合材料自身进行电子束焊接,研究了其接头成形、焊缝组织、热影响区组织及接头力学性能.结果表明,SiCp/Al复合材料自身直接电子束焊接时,接头的主要缺陷是焊缝成形差、易形成两侧堆积颗粒物的凹槽;焊缝组织中存在界面反应产生的灰白色初生硅、深灰色针状相Al4C3以及Al-Si共晶中的浅灰色针状共晶硅,形成脆性区,拉伸断裂位置便在此处,断裂为脆性断裂.熔合区附近硬度较高,与焊缝区组织及硬度差异较大.接头的最高强度为73 MPa,仅占母材平均抗拉强度的41%.The shape,microstructure and the mechanical properties of SiCp/Al composite joint by electron beam welding(EBW) were investigated.The results show the main defects in EWB of SiCp/Al are poor weld appearance with the groove covered by particles.The weld consists of gray Si,dark gray needle phase of Al4C3,which generate from interfacial reaction,and AlSi eutectic phase.The brittle fracture occurs at the brittle zone formed by the above three phases.The high hardness of fusion zone is quite different from that of weld.The average highest tensile strength of the joint is 73 MPa,which is 41% of that of the SiCp/Al base metal.

关 键 词：碳化硅颗粒 铝基复合材料 电子束焊接 微观组织 力学性能 

分 类 号：TG456.3[金属学及工艺—焊接]