SrTiO_3陶瓷基片集群磁流变研磨加工表面特性研究  

Research on SrTiO_3 Ceramics Substrate Surface with Cluster Magnetorheological Effect Lapping

作　　者：刘俊龙[1] 阎秋生[1] 路家斌[1] 潘继生[1] 

机构地区：[1]广东工业大学,广州510006

出　　处：《中国机械工程》2013年第15期2000-2004,共5页China Mechanical Engineering

基　　金：国家自然科学基金资助项目(50875050);广东省自然科学基金资助项目(9251009001000009);NSFC-广东联合基金资助项目(U1034006)

摘　　要：采用集群磁流变效应研磨加工工艺进行SrTiO3陶瓷基片研磨加工,分析了研磨盘材料、磨粒种类、研磨压力和磨粒团聚等因素对SrTiO3陶瓷基片表面粗糙度和表面完整性的影响。结果表明:磁流变效应研磨工作液中的SiC、Al2O3和CeO2等磨料的大尺寸磨粒在SrTiO3陶瓷基片研磨加工表面产生的局部大尺寸划痕破坏了加工表面的完整性;采用铸铁研磨盘和SiO2磨料的磁流变研磨工作液研磨加工后,原始表面粗糙度Ra从约1.7854μm下降到0.6282μm,并且表面完整,SrTiO3材料与SiO2磨料之间存在的化学机械研磨过程促进了研磨加工表面性能的改善;研磨压力也是影响研磨加工表面粗糙度和大尺寸划痕的主要因素之一,研磨压力取较小值(1.875kPa)为宜。The plane lapping of SrTiO3 ceramics substrate by cluster MR-effect technology was researched. The factors that influenced the surface roughness and the integrality, such as the material of lapping disc, the kind of abrasive, the lapping pressure and the abrasive agglomeration, were analyzed. The results demonstrate that the local big scratches which ruin the integrality of the surface are mainly attributed to the big abrasives of SiC, Al2O3 and CeO2. The integrated surface whose roughness decreases from Ra1. 7854μm to RaO. 6282μm can be attained with the iron disc and SiO2 abrasive. The chemical and mechanical processes between SrTiO3 and SiO2 promote the improvement of the surface quality. The grinding pressure of 1. 875kPa is preferred.

关 键 词：SRTIO3 陶瓷 集群磁流变效应 研磨 划痕 

分 类 号：TH161[机械工程—机械制造及自动化]