ICT过程造成组件板故障问题的分析和解决方法  

Solution of PCBA Problem Troubles During ICT

作　　者：阮伟东[1] 

机构地区：[1]厦门华侨电子股份有限公司,福建厦门361006

出　　处：《电子工艺技术》2013年第4期204-208,共5页Electronics Process Technology

摘　　要：如何提高PCB组装元件的装配质量是当今电子产品制造的一个重要课题。ICT测试是目前电子产品生产过程中最常用的测试方法,但是随着无铅焊接的应用,在极大程度上影响了ICT测试的可靠性,对ICT治具在混装电路板的测试要求也越来越高。通过对ICT治具制作工艺的改进、PCB可测试性设计要求等方面提出解决方案,以期使ICT能更好地适应PCBA生产测试需求。How to improve PCBA quality is an important subject in electronic manufacturing.ICT Test is a most common method in electronic manufacturing.However,with the application of fine pitch assemblies and lead-free solder,they will affect ICT test reliability.Therefore more precision for ICT fixture test in PCBA manufacturing is required.Through ICT fixture improvement and requirements of PCB DFT（Design for Testability）,the ICT can meet the test requirement in PCBA manufacturing.

关 键 词：在线测试 ICT治具 弯曲变形 开裂 短路 应变测试 

分 类 号：TN606[电子电信—电路与系统]