毫米波射频互联金丝热超声楔焊工艺优化研究  

Process Optimization of Gold Wire Thermo-sonic Wedge Bonding of Millimeter Wave RF Interconnection

作　　者：任榕[1] 卢绍英[1] 金家富[1] 解启林[1] 邱颖霞[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子工艺技术》2013年第4期239-242,共4页Electronics Process Technology

基　　金：国防基础科研项目(项目编号:A1120110020)

摘　　要：金丝热超声楔焊是微波毫米波模块射频互联的关键手段。采用三维电磁仿真软件对毫米波频段的金丝热超声楔焊进行了建模仿真,分析了金丝跨距、拱高和角度等物理参量对驻波的影响。针对模拟仿真优化后的热超声楔焊金丝互连结构,给出了金丝热超声楔焊表面状态优化、线型控制参数优化以及键合参数优化等相应的工艺优化措施,从而达到热超声楔焊金丝性能优化的目的。Gold wire thermo-sonic wedge bonding is the key means in the RF interconnection of microwave and millimeter wave modules.The three-dimensional electromagnetic simulation software was used to simulate analysis of bond-wire models.Then,the impacts of loop distance,loop height and angle of bond wires on the voltage standing wave ratio were also analyzed.Based on the simulation results,optimum processes such as surface state optimization of the bond interface,loop parameter and bond parameter optimization were provided.And then the optimum performance was obtained for gold wire thermo-sonic bonding process.

关 键 词：金丝热超声楔焊 毫米波射频互联 工艺优化 

分 类 号：TN305[电子电信—物理电子学]