速度滑移对界面热阻影响的分子动力学模拟  

Molecular Dynamics Simulations of the Effect of Velocity Slip on the Solid-Liquid Interfacial Thermal Resistance

作　　者：葛宋[1] 陈民[1] 

机构地区：[1]清华大学航天航空学院,传热强化与过程节能教育部重点实验室,北京100084

出　　处：《工程热物理学报》2013年第8期1527-1529,共3页Journal of Engineering Thermophysics

基　　金：国家自然科学基金(No.51076078);高等学校博士学科点专项科研基金(No.20100002110047)

摘　　要：采用分子动力学模拟比较了纳米通道中液体与固体相对静止、液体流动但界面无速度滑移以及液体流动且界面处存在速度滑移三种情况下的界面热阻,分析了流动和速度滑移对液固界面热阻的影响。模拟结果表明在低流速下流动和速度滑移对界面热阻的影响不显著,在较高流速下会导致界面热阻有10%左右的减小。Molecular dynamics simulations are carried out to investigate the influences of fluid flow and velocity slip on the solid-liquid interracial thermal resistance. It is accomplished by comparing the interfacial thermal resistances under the conditions when the fluid is static or the fluid flows with/without boundary velocity slip. The simulation results demonstrate that the effects of fluid flow and velocity slip on interracial thermal resistance are negligible when the fluid flow is slow, and they will reduce the interracial thermal resistance by about 10% with relatively high flow velocity.

关 键 词：速度滑移 温度跳跃 界面热阻 分子动力学模拟 

分 类 号：TK124[动力工程及工程热物理—工程热物理]