基于对应点匹配插值算法的电阻抗三维图像重建  

Three-dimensional reconstruction of electrical impedance tomography based on corresponding points matching interpolation

作　　者：何为[1,2] 牛富丽[1,2] 李冰[1,2] 徐征[1,2] 

机构地区：[1]重庆大学电气工程学院 [2]输配电装备及系统安全与新技术国家重点实验室,重庆400044

出　　处：《重庆大学学报（自然科学版）》2013年第7期61-65,共5页Journal of Chongqing University

基　　金：中央高校基本科研业务经费资助项目(CDJZR10150021)

摘　　要：为了对电阻抗成像二维重构图像结果进行三维重建,笔者使用对应点匹配插值算法对二维电阻抗图像进行插值,形成三维重建模型。根据电阻抗成像重构数据的特点,改进了插值算法的梯度和梯度方向角计算公式,从而较好地重现层间数据,最后由原始数据和插值数据形成三维体数据。实验的模型是浸泡在圆柱体水槽中电导率为2.1S/m的圆柱体异物。将笔者所提算法与线性算法以及形状插值算法进行了对比。结果表明:笔者算法能够在确保计算精度的同时,兼顾计算效率,满足电阻抗成像的实时监护要求。An interpolation algorithm with corresponding point matching is presented for interpolating two-dimensional reconstructed images of electrical impedance tomography（EIT）to realize three-dimensional reconstruction.The calculation methods of the gradient and its orientation angle have been adjusted according to the characteristic of the EIT data,and the interpolated slice shows good quality.The experimental model is a 2.1 S/m cylinder agar block immersed in a cylindrical water tank.The comparisons of the presented algorithm to the linear interpolation and the shape-based interpolation are made.The results show that corresponding point matching algorithm can ensure both accuracy and computational efficiency,thus the algorithm satisfies the requirements of the real-time EIT monitoring.

关 键 词：电阻抗成像 图像重建 匹配插值 

分 类 号：TM153[电气工程—电工理论与新技术]