直流溅射法制备纳米金的工艺及形成机制  

Process and formation mechanism of nano-gold prepared by DC sputtering

作　　者：窦娜娜[1] 王涵[1] 张蓓[2] 宋西平[1] 

机构地区：[1]北京科技大学新金属国家重点实验室,北京100083 [2]北京科技大学数理学院物理系,北京100083

出　　处：《金属热处理》2013年第8期14-20,共7页Heat Treatment of Metals

摘　　要：利用直流溅射仪制备了纳米金薄膜,并通过随后的退火处理得到了纳米金颗粒,研究了不同衬底、溅射时间、退火温度及时间对纳米金颗粒形成的影响规律。结果表明,衬底对纳米金的形成有显著的影响,形核质点多的载玻片比单晶硅片更容易形成细小的纳米金颗粒;溅射时间越短,退火温度愈高,纳米金薄膜愈容易球化;在溅射30 s、400℃保温60 min的条件下得到了直径为8～12 nm的金颗粒。根据金的表面能、表面张力以及金原子的扩散等因素讨论了纳米金颗粒的形成机制。The gold nanoparticles were prepared by using DC sputtering and annealing,and the effects of substrate types,sputtering time,annealing temperature and time on the formation of gold nanoparticles were investigated.The results show that the substrate has a significant effect on the formation of the gold nanoparticles.The substrate of glass slide which has many nucleation sites can form gold nanoparticles more easily than that of single crystal silicon slice.The shorter the sputter time and the higher the annealing temperature,the easier the spheroidization of the gold nanoparticles.Gold nanoparticles with the dimension of 8-12 nm were obtained at the condition of sputtering 30 s and annealing at 400 ℃ for 60 min.The formation mechanism of gold nanoparticles was discussed based on the surface energy of gold,interfacial energy between gold and substrate as well as the diffusion of gold atoms.

关 键 词：溅射工艺 纳米金 形成机制 

分 类 号：TG111[金属学及工艺—物理冶金]