化学镀镍复合添加剂BH的工艺特性  

Technological properties of composite stabilizer BH for electroless nickel plating

作　　者：鹿轩 梁颖诗[2] 张晓明 林继月 胡耀红 赵国鹏 

机构地区：[1]广州二轻工业科学技术研究所,广东广州510663 [2]华南农业大学,广东广州510642

出　　处：《电镀与涂饰》2013年第8期16-18,共3页Electroplating & Finishing

基　　金：广州市科信局科研条件建设项目(2069903)

摘　　要：开发了一种由含钼化合物、碘化钾以及邻苯二甲酸酐衍生物组成的复合添加剂BH,讨论了它对化学镀镍液稳定性、镀速以及镀层磷含量、硬度、孔隙率和微观形貌的影响。对测试化学镀镍液稳定性的PdCl2试验标准进行了改进:温度由80°C提高到90°C,PdCl2的浓度由0.1g/L增加到1.0g/L。研究结果显示,新标准检验的镀液稳定性差异能较好地反映实际生产中的镀液稳定性差异;当复合添加剂BH的添加量为2.0mL/L时,化学镀镍层微观形貌得到较大的改善。经过新的PdCl2试验标准检验,该镀液可达到900s不发生浑浊,镀速为24μm/h,镀层孔隙率0.57个/cm2,磷含量7.3%,硬度520HV。A composite additive BH consisting of molybdenum-containing compound, potassium iodide, and phthalic anhydride derivative was developed, and its influence on the stability and deposition rate of electroless nickel plating bath, as well as the phosphorus content, hardness, porosity, and micro-morphology of deposit was discussed. The PdCl2 test standard used for determining stability of electroless nickel plating bath was improved as follows： increasing temperature from 80 ℃ to 90 ℃ and PdC12 concentration from 0.1 g/L to 1.0 g/L. The results indicated that the difference of bath stability tested by the improved method has good relevance with that in practical production. The electroless nickel plating bath with composite additive BH 2.0 mL/L remains stable within 900 s without becoming turbid by testing based on the improved method and produces electroless nickel coatings with improved micro-morphologies at a deposition rate of 24 μm/h. The electroless nickel coating obtained has a porosity 0.57 pores/cm2, phosphorus content 7.3% and hardness 520 HV.

关 键 词：化学镀镍 复合添加剂 镀液稳定性 孔隙率 硬度 

分 类 号：TQ153.12[化学工程—电化学工业]