新型铜及铜合金光亮酸洗工艺  

Novel bright pickling process for copper and copper alloys

作　　者：王婷 沈晓 张红军 周瑛 

机构地区：[1]河南平高电气股份有限公司,河南平顶山467001

出　　处：《电镀与涂饰》2013年第8期30-32,共3页Electroplating & Finishing

摘　　要：介绍了一种铜及铜合金无硝酸、无铬光亮酸洗工艺,其主要工序包括化学除油、盐酸漂洗和化学出光。通过正交试验对化学出光溶液组成进行优化,得到最优配方为:H2SO415%,H3PO420%,出光剂A(含氧化剂、缓蚀剂及表面活性剂)20%。该新型抛光剂适用于多种铜及铜合金,工件的光泽与传统混酸洗工艺相当,在自动线上必要的38s内不会对工件产生过腐蚀。A nitric- and chrome-free bright pickling process for Cu and Cu alloys was introduced. The process flow is mainly composed of chemical degreasing, rinsing in hydrochloride acid, and chemical polishing. The composition of the chemical polishing solution was optimized by orthogonal test as follows： H2SO4 15%, HaPO4 20%, and polishing agent A （containing oxidizing agent, corrosion inhibitor, and surfactant） 20%. The novel polishing agent is suitable for different Cu and Cu alloys. The treated workpiece has a comparable brightness to that pickled with traditional mixed acids, and does not corrode during the pickling time of 38 s which is necessary for an automatic production line.

关 键 词：铜及铜合金 光亮酸洗 出光 正交试验 配方 

分 类 号：TG175.3[金属学及工艺—金属表面处理]