LTCC带通滤波器的制作及工艺研究  

Fabrication and Technology Research of Band Pass Filter on LTCC

作　　者：唐月明[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2013年第1期52-54,共3页Hybrid Microelectronics Technology

摘　　要：本文以ZiTiO3作为滤波器的低温共烧介质材料，采用Ansoft High Frequency Structure Simulator（简称HFSS）软件设计与仿真多层带通滤波器，根据仿真的设计结果，指导和优化材料和工艺，并采用多层片式器件生产工艺制备出符合3G标准要求的带通滤波器，使材料、器件设计及生产工艺有机结合。采用该方法，解决了一系列LTCC多层带通滤波器用软件仿真与生产工艺实现的一致性问题。The material ZiTO3 is used as low temperature co - fired dielectric ceramic material for filter, and Ansoft High Frequency Structure Simulator （HFSS） software is used to design and simulate muhilayer band pass filter. According to the simulation results,to guide and optimize materials and process. Multi - layer chip process is utilized to prepare the band pass filter which can meet the 3 G standards requirements, so that the material, device design and production can be combined organically. By using this method to solve a consistency problem between software simulation and production process for a series of LTCC multi- layer band pass filter.

关 键 词：低温共烧介质材料 带通滤波器 仿真 制作 

分 类 号：TN713.5[电子电信—电路与系统]