Contact stress non-uniformity of wafer surface for multi-zone chemical mechanical polishing process  

作　　者：WANG TongQing LU XinChun ZHAO DeWen HE YongYong 

机构地区：[1]State Key Laboratory of Tribology,Tsinghua University

出　　处：《Science China(Technological Sciences)》2013年第8期1974-1979,共6页中国科学（技术科学英文版）

基　　金：supported by the Science Fund for Creative Research Groups (Grant No. 51021064);the National Natural Science Foundation of China (Grant No. 51205226);the China Postdoctoral Science Foundation (Grant No. 2012M510420)

摘　　要：A finite element analysis(FEA)model is developed for the chemical-mechanical polishing(CMP)process on the basis of a 12-in five-zone polishing head.The proposed FEA model shows that the contact stress non-uniformity is less dependent on the material property of the membrane and the geometry of the retaining ring.The larger the elastic modulus of the pad,the larger contact stress non-uniformity of the wafer.The applied loads on retaining ring and zone of the polishing head significantly affect the contact stress distribution.The stress adjustment ability of a zone depends on its position.In particular,the inner-side zone has a high stress adjustment ability,whereas the outer-side zone has a low stress adjustment ability.The predicted results by the model are shown to be consistent with the experimental data.Analysis results have revealed some insights regarding the performance of the multi-zone CMP.

关 键 词：chemical mechanical polishing contact stress NON-UNIFORMITY multi-zone polishing head retaining ring 

分 类 号：TN305.2[电子电信—物理电子学] TQ336.1[化学工程—橡胶工业]