新型复合材料基体液体氰酸酯树脂研究  

Study on novel liquid phenolic cyanate ester as high thermal resistant composite matrix resin

作　　者：朱海荣[1] 黄传进 王明存[1] 王志强 轩立新 

机构地区：[1]北京航空航天大学化学与环境学院,北京100191 [2]中航工业济南特种结构研究所,高性能电磁窗航空科技重点实验室,济南250023

出　　处：《固体火箭技术》2013年第3期403-407,共5页Journal of Solid Rocket Technology

基　　金：航空科学基金(20111851013)

摘　　要：为了解决双酚A型氰酸酯树脂熔点较高、不适合树脂传递模塑成型(RTM)和中低温成型的问题,制备了一种低粘度氰酸酯树脂-液体酚醛氰酸酯树脂(NCE,Novolac cyanate ester resin)。NCE树脂40℃粘度在300 mPa·s以下,热固化温度170～270℃(峰值230℃),160℃时凝胶时间约75 min,适合RTM成型复合材料。NCE树脂为其催化固化提供了流变条件,加入质量百分比为0.5%的二月桂酸二丁基锡可将固化温度降低约80℃,仍然具有良好的RTM工艺窗口。NCE树脂玻璃化温度约350℃,远高于通用的双酚A型氧酸酯树脂(约220℃),适合作为耐高温结构复合材料基体。In order to overcome the shortcomings of Bisphenol-A type cyanate ester resin, one novel liquid cyanate ester resin derived from low molecular phenolic resin was prepared. The liquid phenolic cyanate ester resin had low viscosity of less than 300 mPa · s at 40 ℃, its thermal cure was proceeded readily at 170 - 270 ℃ （ peak value is 230 ℃ ）, and its gelation time at 160 ℃ was found at about 75 min. All the above results revealed the resin was suitable for RTM process. The thermal cure was catalyzed by 0. 5% DBTDL for a lower curing temperature and quiker curing rate. The glass temperature of the pheolic cyanate ester resin was about 350 ℃ ,quite higher than the conventional Bisphenol-A cyanate ester（ about 220 ℃） ,which shows that it is suitable to be used as composite matrix of high temperature structure.

关 键 词：酚醛氰酸酯 树脂传递模塑 热固化 耐高温 

分 类 号：V255[一般工业技术—材料科学与工程]