半导体电火花线切割微接触式放电高效切割机理研究  

Study on the High Efficiency Mechanism in WEDM of Semiconductor in Micro Contact Condition

作　　者：潘慧君[1] 刘志东[1] 邱明波[1] 黄赛娟[1] 田宗军[1] 

机构地区：[1]南京航空航天大学机电学院,南京210016

出　　处：《人工晶体学报》2013年第7期1336-1342,共7页Journal of Synthetic Crystals

基　　金：国家自然科学基金(50975142);江苏省博士后科学基金资助项目(1002009C)

摘　　要：与金属电火花加工不同,由于半导体材料特殊的电特性,在进行半导体电火花线切割加工时,在电极丝与工件接触甚至已经被工件顶弯的状态下依然可以进行火花放电,蚀除工件材料,并且在微接触状态的切割效率还大大提高。研究分析认为:这主要是由于接触势垒和体电阻的存在,导致两极间在微接触时极间电压依旧维持在一个较高值,从而能在与微接触点不同的其他区域产生火花放电。分析了微接触式放电状态下效率提高的机理,认为切割效率的提高主要是由于脉冲放电本身利用效率的提高和侧边放电几率的降低所导致的用于正常蚀除的整体脉冲利用率提高。对微接触状态下的加工精度进行了研究,认为在微接触状态下进行切割加工时,应调整补偿量,以维持较好的加工尺寸精度。Because of the special electrical characteristics, in the spark-erosion wire cutting of semiconductor, when wire electrode is contact with workpiece or even has been bended by the workpiece, sparks can still be generated, removing the workpiece material, which is totally different with metal. And in the micro contact state, the cutting efficiency is greatly improved. Due to the existence of the contact barrier and body resistance, the voltage between the workpiece and electrode is still maintained at high value in micro contact condition. Thus spark discharge that the increase of the cutting efficiency is mainly due can be produced in other area. It is considered to the improvement in utilization rate of pulse and the decrease in the chance of side discharge. In order to maintain good processing dimensional accuracy, compensation quantity should be adjusted in micro contact condition.

关 键 词：电火花线切割 微接触 高效切割 

分 类 号：TG661[金属学及工艺—金属切削加工及机床]