银铜包覆粉末的制备与表征  

Preparation and characterization of Ag-Cu coated powder

作　　者：孟祉含[1] 谢克难[1] 廖立[1] 李延俊[1] 

机构地区：[1]四川大学化学工程学院,四川成都610065

出　　处：《功能材料》2013年第11期1656-1658,1662,共4页Journal of Functional Materials

基　　金：国家自然科学基金资助项目(50904046)

摘　　要：采用液相还原法制备银包铜超细粉末。以抗坏血酸为还原剂采用葡萄糖预还原法制备铜粉末,以水合肼为还原剂制备银包铜粉末,引入不同的分散剂来制备超细铜粉末。并对样品进行SEM、TEM-EDS和XRD等检测。结果表明,通过条件控制可得粒度均匀、球形度好的包覆粉末。该方法设备简单,且易于操作,适合工业生产。In this paper,liquid phase reduction method was applied to prepare superfine copper-silver coated powder.Copper powder was prepared with ascorbic acid as reductant while glucose beforehand reduction method was applied,and copper coated with silver powder was prepared with hydrazine hydrate as reductant.Besides,different dispersants were used to prepare superfine copper powder.SEM,TEM-EDS,XRD techniques were used to characterize the prepared samples.The results showed that uniform coated powder with fine sphericity can be obtained by controlling the conditions.This method was easy to operate and fit for industrial production.

关 键 词：包覆粉末 液相还原法 AG-CU 

分 类 号：TG14[一般工业技术—材料科学与工程]