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作 者:王道翠[1] 王汝敏[1] 杨莹[1] 胡睿[1] 袁利辉[1]
机构地区:[1]西北工业大学理学院应用化学系,陕西西安710072
出 处:《中国胶粘剂》2013年第8期19-22,共4页China Adhesives
摘 要:以硼酸作为高羟甲基低游离酚PF(酚醛树脂)的改性剂,制备相应的BPF(硼改性酚醛树脂)及其模塑料。采用红外光谱(FT-IR)法对BPF的结构进行了表征,并对其凝胶化时间、固化工艺条件、热性能和模塑料的性能等进行了探讨。研究结果表明:当w(B)=9%时,BPF及其模塑料的综合性能相对最好,其固化工艺为160℃/20 min,后处理工艺为"140℃/1 h→160℃/1 h→180℃/2 h";与纯PF模塑料相比,BPF模塑料的马丁耐热温度(196℃)提高了42℃、弯曲强度(111.8 MPa)提高了21.9 MPa且冲击强度(18.50 kJ/m2)也有所提高。With boric acid as a modifier of PF(phenolic resin) with high hydroxymethyl and low free- phenol, a corresponding BPF(PF modified by boron) and its molding compound were prepared. The structure of BPF was characterized by infrared spectrum(FT-IR) method, and its gelation time, curing process conditions,thermal properties,and properties of molding compound were discussed. The research results showed that the BPF and its molding compound had the relatively best combination property,its curing process was 160 ℃/20 min,and its post-treatment process was "140℃/Ih→160℃/1h→180℃/2h" when mass fraction of boron was 9%. Compared with pure PF molding compound,the Martin heat resistance temperature(196℃) and bending strength(111.8 MPa) of BPF molding compound were 42℃ and 21.9 MPa respectively more than those of pure PF molding compound, and the impact strength( 18.50 kJ/m2) of BPF molding compound was also improved.
分 类 号:TQ323.1[化学工程—合成树脂塑料工业]
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