溶胶喷雾干燥法制备的W-Cu纳米复合粉末的烧结致密化与晶粒长大  

Densification and grain growth of W-Cu composite powders synthesized by sol-spray drying

作　　者：郭垚峰[1] 范景莲[1] 刘涛[1] 于林[1] 

机构地区：[1]中南大学粉末冶金国家重点实验室,长沙410083

出　　处：《粉末冶金材料科学与工程》2013年第3期384-389,共6页Materials Science and Engineering of Powder Metallurgy

基　　金：国家杰出青年科学基金资助项目(50925416);国家青年科学基金资助项目(51004116)

摘　　要：采用溶胶喷雾干燥法制备W-25Cu、W-30Cu纳米复合粉末,在1 300~1 420℃下烧结15~120 min,得到W-25Cu和W-30Cu复合材料,对该复合粉末的致密化和钨晶粒长大行为进行研究。结果显示,随烧结时间延长或烧结温度升高,W-25Cu和W-30Cu复合材料更加致密,在1 420℃下烧结120 min后接近全致密,相对密度分别为98.09%和99.13%。W-25Cu、W-30Cu复合材料在1 380℃烧结30~120 min的晶粒长大符合溶解–析出机制,烧结温度对晶粒长大的影响较成分影响更大。在1 420℃烧结120 min后,W-25Cu和W-30Cu的晶粒尺寸分别为1.17μm和1.13μm。W-25Cu/W-30Cu composite powders fabricated by sol-spray drying method were sintered at 1 300～1 420 ℃ for 15～120 min.The densification and grain growth behavior of the composite were studied.The results show that,the densification of W-25Cu/W-30Cu composite gradually increases with increasing sintering time and temperature.The relative density of W-25Cu and W-30Cu composite materials sintered at 1 420 ℃ for 120 min are 98.09% and 99.13%,respectively,which approach to the full theoretical density.Meanwhile,the grain growth of W-25Cu/W-30Cu composite sintered at 1 380 ℃ for 30～120 min is in accord with dissolved-precipitation mechanism,and the effect of sintering temperature on grain growth is more significant than that of the composition.After sintering at 1 420 ℃ for 120min,the grain size of W-25Cu and W-30Cu are 1.17 μm and 1.13 μm,respectively.

关 键 词：W-CU 液相烧结 致密化 晶粒长大 

分 类 号：TG146.4[一般工业技术—材料科学与工程]